DDR3 DRAM Chip · Extreme · CN
FBGA96 · ×16 · CN supply
Key facts
What industrial buyers usually need to know first — before diving into the full datasheet.
5-year supply · 12-month EOL notice
Qualified SKUs stay available for long-lifecycle equipment — you get advance notice before any discontinuation.
MOQ from 1 pc
Prototype and repair lots without large inventory lock-in — then scale to production.
BOM review & firmware fit
We help match incumbent PNs, validate drop-in paths, and can adjust firmware / grade when the catalog needs a tweak.
5-year warranty · 4–8 weeks lead time
Stable production scheduling with a typical 4–8 weeks lead time once configuration and forecast are agreed.
| MOQ | From 1 pc |
|---|---|
| Standard lead time | 4–8 weeks (typical; confirm with sales for your configuration) |
| Warranty | 5 years (see /warranty for tier details) |
| Supply commitment | Minimum 5 years for qualified SKUs · 12-month EOL notice |
| Engineering support | BOM review, drop-in / fit checks, firmware and temperature-grade adaptation on request |
| Samples | Available on request |
Overview
Industrial DDR3 DRAM chips based on JinYuan die in FBGA96 (×16). Rated down to −55°C with 1.35 V / 1.5 V operation and JEDEC-aligned pinouts — for embedded controllers, industrial compute, and CN-labeled BOMs that still standardize on DDR3.
Specifications
| Interface | DDR3 (SSTL) |
|---|---|
| Package | FBGA96 |
| Density | 2Gb–4Gb (×16) |
| Operating temperature | −55°C to +125°C |
| Storage temperature | −45°C to +90°C |
| Data rate | 800 / 933 MHz |
| Supply voltage | 1.35 V / 1.5 V |
| Bit width | ×16 |
| Supply option | China-localized (CN) |
| Warranty | 5 years |
Orderable part numbers
Handbook PNs for this page. Confirm package, temperature bin, and speed grade before production.
| Part number | Grade | Summary |
|---|---|---|
YZ38E16SBB-9MFB-M |
GJB-STD | 2Gb · -55℃~+125℃· xref MT41K128M16JT-125IT:K |
YZ38E16SBB-9MFB-M(O) |
Wide-temp | 2Gb · -40℃~+85℃· xref MT41K128M16JT-125IT:K |
YZ38F16SBB-9MFD-M |
GJB-STD | 4Gb · -55℃~+125℃· xref MT41K256M16HA-125IT |
YZ38F16SBB-9MFD-M(O) |
Wide-temp | 4Gb · -40℃~+85℃· xref MT41K256M16HA-125IT |
YZ38G16SDB-9INN-M(0) |
Wide-temp | 8Gb · 512Mb×16 · FBGA96 · −40~+85°C Industrial (datasheet; not in 2026 PDF table) |
Cross-references
Vendor families for BOM exploration. Always validate ball map, speed bin, and temperature grade on your host.
Compliance & Standards
Quality and release processes for Loongtion industrial memory and storage. Formal certificates and scope statements are available in the quotation pack on request.
Quality management system
-
ISO 9001:2015 certified (GB/T 19001-2016)
Quality management systems — Requirements. Certified quality system covering semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
-
Conforms to GJB 9001C—2017
Quality management systems — Requirements. Quality system practices conform to GJB 9001C for the same scope: semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
Environmental methods (GJB-STD)
For Extreme-temp / GJB-STD SKUs, environmental planning and screening reference the following methods. This is not a claim of third-party product certification under these standards.
-
GJB 150A (aligned with MIL-STD-810 methods)
Military equipment laboratory environmental test methods. GJB-STD SKUs are designed and screened with reference to GJB 150A; it is the Chinese military counterpart commonly mapped to MIL-STD-810 style environmental methods.
Product & interface standards
This catalog SKU follows the industry specifications that define its form factor and host interface.
-
JEDEC DRAM specifications
DDR3 / DDR4 / DDR5 / LPDDR families follow applicable JEDEC device and signaling specifications for the listed density, organization, and speed bin.
-
JEDEC DDR SDRAM
DDR3 / DDR4 / DDR5 devices follow applicable JEDEC DDR specifications for the listed density, organization, and speed bin.
Grade wording: Product grade definition.
Key highlights
What matters for BOM review and board bring-up.
-
Wide-temp industrial grade
−55°C to +125°C operating range for sealed cabinets, outdoor edge, and harsh plant floors.
-
FBGA96 · ×16
JEDEC-aligned ball map for common DDR3 controllers — confirm speed bin and CWL on your host.
-
Dual-voltage rail
1.35 V / 1.5 V support for mixed DDR3L and DDR3 platforms.
-
China-localized supply (CN)
JinYuan-based die with domestic supply options for CN-labeled programs.
-
Handbook PNs
Orderable grades published on this page — match package, temperature bin, and speed before production.
Typical applications
Where this SKU is commonly designed in.
Industrial embedded controllers
Long-life DDR3 hosts that need stable wide-temp memory without redesigning for DDR4/DDR5.
- FBGA96 footprint
- ×16 organization
- CN supply path when required
Harsh-environment compute
Vehicle, outdoor cabinet, and plant-floor systems rated below −40°C.
- −55°C low-end rating
- Dual voltage
- Validate ball map vs Micron/Samsung drop-ins
Series
-
Industrial DDR3 DRAM
Wide-temperature DDR3 DRAM chips for embedded platforms.
-
Industrial DRAM Chips
Industrial solder-down DRAM: DDR3, DDR4, DDR5, LPDDR4X.
Frequently asked questions
What is the operating temperature range of the Loongtion DDR3 chip?
YZ38 series covers commercial (0C to +70C), industrial (-40C to +85C), and GJB extreme (-55C to +105C) grades. The extreme grade is a Loongtion advantage not offered by most vendors.
Is this a drop-in replacement for Micron/Samsung/SK hynix DDR3?
Yes. YZ38 series provides pin-to-pin or functional replacements for Micron MT41K128M16JT / MT41K256M16, Samsung K4B4G1646 / K4B2G1646, SK hynix H5TQ4G63 / H5TQ2G63, ISSI IS43TR16256BL, and Winbond W632GU6KB. See the cross-reference catalog for the exact mapping.
What are the key specifications?
512Mb to 8Gb, DDR3-800 to DDR3-2133, 1.5V (DDR3) / 1.35V (DDR3L), standard BGA packages, commercial to GJB temperature grades.
What is the lead time?
4-8 weeks for standard orders, ideal for legacy board maintenance and EOL replacement.
Engineering guides
-
ISSI IS43TR16256BL / Winbond W632GU6KB Replacement: Loongtion DDR3 Cross-Reference Guide
ISSI IS43TR16256BL or Winbond W632GU6KB DDR3 replacement? Compare specs, temperature grades and pin-out with Loongtion YZ38E16SBB-9MFB-M.
-
DDR3 DDR3L Replacement Guide: Cross-Referencing Legacy Industrial Memory in 2026
Find drop-in DDR3 and DDR3L replacements for EOL Micron MT41K and Samsung DDR3 parts. Complete cross-reference table with 12+ Loongtion PNs...
-
DDR3 Legacy Replacement: A Field Engineer's Guide
Field checklist for keeping long-life industrial DDR3 boards alive — package, organization, voltage, speed bin, and temperature grade — with...
-
Migrating from DDR3 to DDR5: A Design-First Integration Framework for Industrial Systems
Industrial system architects rarely have the luxury of designing a single product generation in isolation. A typical PLC or edge gateway pla...
-
Multi-Generational DRAM BOM Strategies: Balancing DDR3, DDR4, and DDR5 in Long-Life Industrial Designs
Industrial equipment such as PLCs, HMIs, and embedded controllers often have production lifecycles exceeding ten years. A product designed t...
-
DDR3 vs DDR4 in Industrial Embedded Systems: A Performance Trade-off Analysis for Migration Decisions
When Migration from DDR3 to DDR4 Makes Sense (and When It Doesn't)Industrial embedded system designers face a recurring dilemma: stick with...
Related products
8Gb DDR4 DRAM Chip · Wide-temp · CN
- DDR4 bandwidth
- China-localized supply (CN)
- Drop-in planning
Industrial 16Gb DDR5 DRAM Chip
- DDR5 bandwidth
- 1.1 V operation
- WBGA-82 · ×8
LPDDR4X DRAM Chip
- Slim FBGA178/FBGA200 package
- 0.6V core ultra-low voltage
- 100% domestic solution
DDR3 DRAM Chip · Wide-temp · CN
- Both Wafer and Packaging &
- Standard SSTL Interface
- Supports Dual Voltages
Product grade definition
What "GJB-standard" means on this website
How we use this label on our site: reliability tier, documentation, and use-case boundaries.
On this website, "GJB-standard" refers to a higher-reliability product tier within our portfolio. It emphasizes environmental robustness, reliability validation, and manufacturing/quality controls that exceed typical consumer-grade products and, where stated for a given SKU, exceed the baseline of our standard Industrial offerings. This label is used to reduce confusion between product grades and does not constitute a representation that any product is suitable for any particular application, including military end-use.
Any differences versus Industrial are defined per SKU in the applicable datasheet / technical documentation (for example: wider operating temperature, stricter mechanical/climatic stress validation, tighter consistency and traceability controls, where applicable).
GJB (if referenced for a product): applicable clauses, test items, and whether requirements apply to product specifications versus management system certification scope are governed solely by that product's technical documentation and, where applicable, the scope of certification. For additional documentation, please contact us (additional materials may be provided under NDA or after customer qualification, as applicable).